IC failure is also one of the most common display failures. Due to the smaller dot pitch, the denser the arrangement of the lamp beads. As the main components to control the lamp beads, the number will increase accordingly, and the arrangement of the components in the unit area The degree of difficulty, the possibility of mutual influence will rise sharply. In addition, the IC itself is a very fragile component, and there are many tiny circuits connected to the body. Therefore, in terms of volume, heat dissipation, solder stability, etc., maintenance after IC failure is mainly replaced by replacement. host. In indoor use scenarios, ICs are mostly exposed and easy to replace. For outdoor products, especially waterproof modules, ICs will be coated or glued. In this case, a very narrow space will be formed between itself and the PCB bottom case. Space needs to be dealt with. The effect of thermal expansion and contraction also puts forward requirements for the arranged components and the hot melt state of the glue. A little carelessness will cause component damage or short circuit.

 

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